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Side Lead Package

  • High Power and Brightness with a Single Emitter
  • Higher Current Operation than TO Packages
  • Excellent Heat Dissipation

Product Features

The lead pins are mounted horizontally on the side of the package, and laser light is emitted horizontally through the aperture window on the side of the package. The package design aligns the laser chip's heatsink surface with the package mounting surface, enabling efficient heat dissipation. It also supports the mounting of high-power laser chips with longer cavity lengths. To meet different application requirements, both integrated and non-integrated Fast Axis Collimation (FAC) lens options are available.

Product Specification Example

NUBC311/NUBC321

Product Specification

Items Symbol Spec (Typ.)* Unit
Dominant Wavelength λd 465 nm
Optical Output Power Po 13.0 W
Forward Voltage VF 3.9 V
Beam
Divergence**		 w/o FAC
(NUBC31)		 Parallel θ∥ 10.0 °
Perpendicular θ⊥ 44 °
FAC built in
(NUBC32)		 Parallel θ∥ 10.0 °
Perpendicular θ⊥ 0.16 °

*IF=8.5A, TC=20°C, CW
**Full angle at 1/e2 of the maximum intensity.

I-L Characteristics

Compared with TO-packaged devices, this package supports higher forward current operation and higher optical output power. At 465nm, optical output power of up to 13W can be achieved from a single emitter.

Reliability

Optical output degradation remains minimal even during long-term continuous operation, with less than 5% output power degradation after 4,000 hours of operation.

1"NUBC31" and "NUBC32" are Nichia's part numbers.

Example Applications

  • Fiber-coupled Laser Modules
  • Laser Processing
  • Laser Marking
  • Laser Engraving, etc.

Contact

Support for a wide range of wavelengths through chip customization. For more information or product inquiries, contact Nichia.

Contact