Multi-chip Package
OctoLas™ / QuaLas™
OctoLas™
This product integrates multiple laser diode chips into a single package. The laser beams are collimated by an array lens mounted on the top of the package and emitted vertically in a two-dimensional array pattern. Compared with configurations using individually packaged laser diodes, such as TO packages, this design enables higher power density within a smaller footprint. Typically, a single package contains 28 to 32 laser diode chips. In addition, each row of the two-dimensional array consists of 7 to 8 laser diodes connected in series, with a pair of anode and cathode pins provided on the side of the package.
Product Specification Example：NUBM3N1
Product Specification
| Items | Symbol | Spec (Typ.)* | Unit |
|---|---|---|---|
| Dominant Wavelength | λd | 455 | nm |
| Optical Output Power | Po | 200 | W |
| Forward Voltage | VF | 109 | V |
| Beam Divergence Parallel** | θ∥ | 0 | ° |
| Beam Divergence Perpendicular** | θ⊥ | 0.42 | ° |
*IF=3.5A, Tm=25°C, CW, 28 LDs are electrically connected in series. (Tm: Module Temperature)
**Full angle at 1/e2 of the maximum intensity.
I-L Characteristics
The graph shows the forward current versus optical output power characteristics of a package with 28 chips connected in series. Stable performance is maintained even under high-temperature operating conditions.
Reliability
Optical output degradation remains minimal even during long-term continuous operation in high-temperature environments, with less than 5% output power degradation after 3,000 hours of operation.
1"NUBM3N" is Nichia's part number.
QuaLas™
This product consists of one or two packages containing multiple laser diode chips mounted on a wiring substrate. The laser beams are collimated by array lenses integrated on top of each package and emitted vertically in a one-dimensional array pattern. Compared with solutions using individually packaged laser diodes, such as TO packages, this design enables the integration of a larger number of laser diodes within a smaller footprint. Typically, each package contains four to five laser diode chips. The product offerings include configurations with either one package or two packages mounted on a wiring substrate.
The laser diodes within each package are connected in series and can be electrically connected through a connector on the wiring substrate. Product temperature can be monitored using an integrated thermistor. In addition, various wavelengths can be supported through chip customization.
Product Specification Example2
Product Specification
| Items | Symbol | Spec (Typ.)* | Unit | ||||
|---|---|---|---|---|---|---|---|
| Wavelength | λd | 455 | 488 | 525 | 532 | 639- 647 |
nm |
| Optical Output Power** |
Po | 34/68 | 9.5/19 | 11/22 | 6.5/13 | 6.6/13 | W |
| Forward Current | IF | 3.0 | 1.9 | 2.4 | 1.9 | 1.45 | A |
| Forward Voltage** | VF | 20/39 | 21/42 | 21/41 | 22/44 | 11/21 | V |
| Beam Divergence Parallel*** |
θ∥ | <1 | <1 | <1 | <1 | <1 | ° |
| Beam Divergence Perpendicular*** |
θ⊥ | 0 | 0 | 0 | 0 | 0 | ° |
*Tm=25°C, CW, All LDs in the package are electrically connected in series. (Tm: Module Temperature)
**The values are listed as follows: 5 LD version / 10 LD version.
***Full angle at 1/e2 of the maximum intensity.
I-L Characteristics
The graph shows the forward current versus optical output power characteristics of QuaLas™ incorporating five 455nm laser diode chips. Stable performance is maintained even under high-temperature operating conditions.
Reliability
Less than 5% optical output power degradation after 20,000 hours of continuous operation in a high-temperature environment.
2Preliminary specifications for products under development.
Example Applications
- Applications with Spatial Light Modulators (SLMs)
- 3D Printing
- Laser Heating
- Industrial Inspection Lighting
- Laser Weeding
- Searchlights
- Stage and Stadium Lighting, etc
Contact
Nichia has the ability to support a wide range of wavelengths through chip customization.
For more information or product inquiries, contact Nichia.